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| PC3SD21NTZB Series PC3SD21NTZB Series s Features 1. Low zero-cross voltage (VOX[MAX.]=20V) 2. Isolation voltage between input and output (Viso (rms):5kV) 3. High critical rate of rise of OFF-state voltage (dV/dt:MIN. 1 000V/s) 4. Recognized by UL, file No. E64380 5. VDE:Under application (optionally available) PC3SD21NTZB Series are for 200V line Phototriac Coupler for Triggering s Outline Dimensions (Unit : mm) Internal connection diagram 6 5 4 6 5 4 6.50.3 Anode mark 3SD21 Zero cross NC circuit 1 2 3 CTR Rank mark 1 2 3 0.60.2 1.20.3 s Applications 1. Home appliances 2. OA equipment, FA equipment 3. SSRs 7.120.3 7.620.3 s Model Line-up Minimum trigger current (IFT[MAX.]) 7mA 5mA 3mA for AC 200V line PC3SD21NTZB PC3SD21NTZC PC3SD21NTZD (Ta=25C) Unit mA V A A V C C kV C 3.250.5 3.50.5 2.90.5 0.5TYP. 0.260.1 =0 to 13 0.5 0.1 2.540.25 1 2 3 Anode Cathode NC 4 5 6 Anode, Cathode No external connection Anode, Cathode s Absolute Maximum Ratings *1 Pin 5 is not allowed external connection Parameter Symbol Rating 50 Forward current IF Input Reverse voltage VR 6 *1 RMS ON-state current IT (rms) 0.1 Output Peak one cycle surge current Isurge 1.2 (50Hz sine wave) Repetitive peak OFF-state voltage VDRM 600 Operating temperature -30 to +100 Topr -55 to +125 Tstg Storage temperature *2 Isolation voltage Viso (rms) 5 Soldering temperature Tsol 260 (For 10s) *1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig.1, 2 *2 AC for 1 min, 40 to 60%RH, f=60Hz Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ PC3SD21NTZB Series s Electro-optical Characteristics Input Symbol Parameter VF Forward voltage Reverse current IR Repetitive peak OFF-state current IDRM ON-state voltage VT IH Holding current Critical rate of rise of OFF-state voltage dV/dt PC3SD21NTZB Zero-cross voltage PC3SD21NTZC PC3SD21NTZD PC3SD21NTZB Minimum trigger current PC3SD21NTZC PC3SD21NTZD Isolation resistance Turn-on time VOX Conditions IF=20mA VR=3V VD=VDRM IT=0.1mA VD=4V - VD=(1/2) * VDRM Resistance load, IF=15mA Resistance load, IF=8mA MIN. - - - - 0.1 1 000 - - - - 5x1010 - TYP. 1.2 - - - - 2 000 - - - - 1x1011 - MAX. 1.4 10-5 10-6 2.5 3.5 - 20 7 5 3 - 50 (Ta=25C) Unit V A A V mA V/s V Output Transfer characteristics IFT RISO ton VD=4V, RL=100 DC=500V, 40 to 60%RH VD=4V, RL=100, IF=20mA mA s Fig.1 RMS ON-state Current vs. Ambient Temperature 175 150 125 100 75 50 25 0 Fig.2 Forward Current vs. Ambient Temperature 70 60 Forward current IF (mA) 50 40 30 20 10 0 RMS ON-state current Ir (rms) (mA) -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (C) -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient temperature Ta (C) PC3SD21NTZB Series Fig.3 Forward Current vs. Forward Voltage (PC3SD21NTZB) 200 100 Forward current IF (mA) 50 100 Ta=100C Forward current IF (mA) 50 50C 20 25C 10 5 2 1 0.9 -25C 0C 75C 50C 20 10 5 25C 0C -30C Ta=75C Fig.4 Forward Current vs. Forward Voltage (PC3SD21NTZC, PC3SD21NTZD) 2 1 0 0.5 1 1.5 2 2.5 3 Forward voltage VF (V) 1 1.1 1.2 1.3 1.4 1.5 Forward voltage VF (V) Fig.5 Minimum Trigger Current vs. Ambient Temperature (PC3SD21NTZB) 10 9 Minimum trigger current IFT (mA) 8 7 6 5 4 3 2 1 0 -40 -20 0 20 40 60 80 100 VD=4V Fig.6 Minimum Trigger Current vs. Ambient Temperature (PC3SD21NTZC, PC3SD21NTZD) 10 9 Minimum trigger current IFT (mA) 8 7 6 5 4 3 2 1 0 -40 -20 0 20 40 60 80 100 VD=4V Ambient temperature Ta (C) Ambient temperature Ta (C) Fig.7 ON-state Voltage vs. Ambient Temperature 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 -40 IT=100mA Fig.8 Holding Current vs. Ambient Temperature 1 VD=4V Holding current IH (mA) ON-state voltage VT (V) 0.1 -20 0 20 40 60 80 100 0.01 -40 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) PC3SD21NTZB Series Fig.9 Repetitive Peak OFF-state Current vs. Ambient Temperature 10 Repetitive peak OFF-state current IDRM (A) VD=600V 1 Relative repetitive peak OFF-state voltage VDRM (Tj=Ta) / VDRM (Tj=25C) Fig.10 Relative Repetitive Peak OFF-state Voltage vs. Ambient Temperature 1.3 1.2 1.1 0.1 1 0.9 0.01 0.8 0.7 -40 0.001 -40 -20 0 20 40 60 80 100 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) Fig.11 Turn-on Time vs. Forward Current (PC3SD21NTZB) 1 000 VD=6V RL=100 Ta=25C Fig.12 Turn-on Time vs. Forward Current (PC3SD21NTZC, PC3SD21NTZD) 1 000 VD=6V RL=100 Ta=25C Turn-on time tON (s) Turn-on time tON (s) 100 100 10 1 10 Forward current IF (mA) 100 10 1 10 Forward current IF (mA) 100 Fig.13 Zero-cross Voltage vs. Ambient Temperature (PC3SD21NTZB) 20 18 Zero-cross voltage VOX (V) R load, IF=15mA Fig.14 Zero-cross Voltage vs. Ambient Temperature (PC3SD21NTZC, PC3SD21NTZD) 20 18 Zero-cross voltage VOX (V) 16 14 12 10 8 6 4 2 R load, IF=8mA 16 14 12 10 8 6 4 2 0 -40 -20 0 20 40 60 80 100 0 -40 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) Application Circuits NOTICE qThe circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. qObserve the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). qContact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. qContact and consult with a SHARP representative if there are any questions about the contents of this publication. 115 |
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